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1 motorola tmos power mosfet transistor device data
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nchannel enhancementmode silicon gate this a dvance d t mo s e fet i s d esigne d t o w ithstan d h igh energy in the avalanche and commutation modes. the new energy efficient d esig n a ls o o ffer s a d raintosourc e d iode w it h a f ast recovery t ime . d esigne d f o r l o w v oltage , h ig h s pee d s witching application s i n p owe r s upplies , c onverter s a n d p w m m otor controls, these devices are particularly well suited for bridge circuits where d iod e s pee d a n d c ommutatin g s af e o peratin g a rea s a re critical a n d o ffe r a dditiona l s afet y m argi n a gainst u nexpected voltage transients. ? avalanche energy specified ? sourcetodrain diode recovery time comparable to a discrete fast recovery diode ? diode is characterized for use in bridge circuits ? i dss and v ds(on) specified at elevated temperature ? surface mount package available in 16 mm, 13inch/2500 unit tape & reel, add t4 suffix to part number maximum ratings (t c = 25 c unless otherwise noted) rating symbol value unit draintosource voltage v dss 100 vdc draintogate voltage (r gs = 1.0 m w ) v dgr 100 vdc gatetosource voltage e continuous gatetosource voltage e nonrepetitive (t p 10 ms) v gs v gsm 15 20 vdc vpk drain current e continuous drain current e continuous @ 100 c drain current e single pulse (t p 10 m s) i d i d i dm 10 6.0 35 adc apk total power dissipation @ t c = 25 c derate above 25 c total power dissipation @ t a = 25 c, when mounted to minimum recommended pad size p d 40 0.32 1.75 watts w/ c watts operating and storage temperature range t j , t stg 55 to 150 c single pulse draintosource avalanche energy e starting t j = 25 c (v dd = 25 vdc, v gs = 5.0 vdc, i l = 10 apk, l = 1.0 mh, r g =25 w ) e as 50 mj thermal resistance e junction to case thermal resistance e junction to ambient thermal resistance e junction to ambient, when mounted to minimum recommended pad size r q jc r q ja r q ja 3.13 100 71.4 c/w maximum t emperature for soldering purposes, 1/8 from case for 10 seconds t l 260 c designer's data for aw orst caseo conditions e the designer' s data sheet permits the design of most circuits entirely from the information presented. soa limit curves e representing boundaries on device characteristics e are given to facilitate aworst caseo design. efet and designer' s are trademarks of motorola, inc. tmos is a registered trademark of motorola, inc. thermal clad is a trademark of the bergquist company . preferred devices are motorola recommended choices for future use and best overall value. order this document by mtd10n10el/d semiconductor technical data ? motorola, inc. 1995 tmos power fet 10 amperes 100 volts r ds(on) = 0.22 ohm motorola preferred device ? d s g case 369a13, style 2 dpak surface mount
2 motorola tmos power mosfet transistor device data electrical characteristics (t j = 25 c unless otherwise noted) characteristic symbol min typ max unit off characteristics draintosource breakdown voltage (v gs = 0 vdc, i d = 0.25 madc) temperature coefficient (positive) v (br)dss 100 e e 115 e e vdc mv/ c zero gate voltage drain current (v ds = 100 vdc, v gs = 0 vdc) (v ds = 100 vdc, v gs = 0 vdc, t j = 125 c) i dss e e e e 10 100 m adc gatebody leakage current (v gs = 15 vdc, v ds = 0 vdc) i gss e e 100 nadc on characteristics (1) gate threshold voltage (v ds = v gs , i d = 250 m adc) threshold temperature coefficient (negative) v gs(th) 1.0 e 1.45 4.0 2.0 e vdc mv/ c static draintosource onresistance (v gs = 5.0 vdc, i d = 5.0 adc) r ds(on) e 0.17 0.22 ohm draintosource onvoltage (v gs = 5.0 vdc, i d = 10 adc) (v gs = 5.0 vdc, i d = 5.0 adc, t j = 125 c) v ds(on) e e 1.85 e 2.6 2.3 vdc forward transconductance (v ds = 15 vdc, i d = 5.0 adc) g fs 2.5 7.9 e mhos dynamic characteristics input capacitance (v ds = 25 vdc, v gs = 0 vdc, f = 1.0 mhz) c iss e 741 1040 pf output capacitance (v ds = 25 vdc, v gs = 0 vdc, f = 1.0 mhz) c oss e 175 250 reverse transfer capacitance f = 1.0 mhz) c rss e 18.9 40 switching characteristics (2) turnon delay time (v dd = 50 vdc, i d = 10 adc, v gs = 5.0 vdc, r g = 9.1 w ) t d(on) e 11 20 ns rise time (v dd = 50 vdc, i d = 10 adc, v gs = 5.0 vdc, r g = 9.1 w ) t r e 74 150 turnoff delay time v gs = 5.0 vdc, r g = 9.1 w ) t d(off) e 17 30 fall time g = 9.1 w ) t f e 38 80 gate charge (see figure 8) (v ds = 80 vdc, i d = 10 adc, v gs = 5.0 vdc) q t e 9.3 15 nc (see figure 8) (v ds = 80 vdc, i d = 10 adc, v gs = 5.0 vdc) q 1 e 2.56 e (v ds = 80 vdc, i d = 10 adc, v gs = 5.0 vdc) q 2 e 4.4 e q 3 e 4.66 e sourcedrain diode characteristics forward onvoltage (1) (i s = 10 adc, v gs = 0 vdc) (i s = 10 adc, v gs = 0 vdc, t j = 125 c) v sd e e 0.98 0.898 1.6 e vdc reverse recovery time (see figure 14) (i s = 10 adc, v gs = 0 vdc, di s /dt = 100 a/ m s) t rr e 124.7 e ns (see figure 14) (i s = 10 adc, v gs = 0 vdc, di s /dt = 100 a/ m s) t a e 86 e (i s = 10 adc, v gs = 0 vdc, di s /dt = 100 a/ m s) t b e 38.7 e reverse recovery stored charge q rr e 0.539 e m c internal package inductance internal drain inductance (measured from the drain lead 0.25 from package to center of die) l d e 4.5 e nh internal source inductance (measured from the source lead 0.25 from package to source bond pad) l s e 7.5 e nh (1) pulse test: pulse width 300 m s, duty cycle 2%. (2) switching characteristics are independent of operating junction temperature.
3 motorola tmos power mosfet transistor device data typical electrical characteristics figure 1. onregion characteristics figure 2. transfer characteristics figure 3. onresistance versus drain current and temperature figure 4. onresistance versus drain current and gate voltage figure 5. onresistance variation with temperature figure 6. draintosource leakage current versus voltage d i , drain current (amps) 10 5 0 0 2 5 3 1 v ds , draintosource voltage (volts) v gs = 10 v 7 v 3.5 v 4 v 5 v t j = 25 c d i , drain current (amps) 5 0 1 2 3 4 5 v gs , gatetosource voltage (volts) v ds 5 v 55 c t j = 100 c 4 15 20 4.5 v 25 c 15 20 3 v 2 v 10 r ds(on) , draint osource resist ance (ohms) i d , drain current (amps) t j = 25 c v gs = 5 v 10 v 0.25 0.2 5 10 20 15 r ds(on) , draint osource resist ance (ohms) 0.35 0.25 0.15 0.05 0 5 10 i d , drain current (amps) v gs = 10 v t j = 25 c 100 c 55 c 0.15 0.1 0 15 20 v ds , draintosource voltage (volts) i dss , leakage (na) v gs = 0 v 0 40 60 1 100 20 100 t j = 125 c 10 100 c r ds(on) , draint osource resist ance (normalized) t j , junction temperature ( c) v gs = 5 v i d = 5 a 50 0 50 100 150 125 25 25 75 2 1.5 1 0.5 0 80
4 motorola tmos power mosfet transistor device data power mosfet switching switching behavior is most easily modeled and predicted by recognizing that the power mosfet is charge controlled. the l ength s o f v ariou s s witchin g i nterval s ( d t ) a r e d eter- mined by how fast the fet input capacitance can be charged by current from the generator. the published capacitance data is dif ficult to use for calculat - ing rise and fall because draingate capacitance varies great - ly with applied voltage. accordingly , gate charge data is used. in most cases, a satisfactory estimate of average input current (i g(av) ) can be made from a rudimentary analysis of the drive circuit so that t = q/i g(av) during the rise and fall time interval when switching a resistive load, v gs remains virtually constant at a level known as the plateau voltage, v sgp . therefore, rise and fall times may be approximated by the following: t r = q 2 x r g /(v gg v gsp ) t f = q 2 x r g /v gsp where v gg = the gate drive voltage, which varies from zero to v gg r g = the gate drive resistance and q 2 and v gsp are read from the gate charge curve. during the turnon and turnof f delay times, gate current is not constant. the simplest calculation uses appropriate values from the capacitance curves in a standard equation for voltage change in an rc network. the equations are: t d(on) = r g c iss in [v gg /(v gg v gsp )] t d(off) = r g c iss in (v gg /v gsp ) the capacitance (c iss ) is read from the capacitance curve at a voltage corresponding to the offstate condition when calcu- lating t d(on) and is read at a voltage corresponding to the on state when calculating t d(off) . at high switching speeds, parasitic circuit elements com - plicate the analysis. the inductance of the mosfet source lead, inside the package and in the circuit wiring which is common to both the drain and gate current paths, produces a voltage at the source which reduces the gate drive current. the voltage is determined by ldi/dt, but since di/dt is a func- tion of drain current, the mathematical solution is complex. the m osfe t o utpu t c apacitanc e a ls o c omplicate s t he mathematics. and finally, mosfets have finite internal gate resistance w hic h e ffectivel y a dd s t o t he r esistanc e o f t he driving source, but the internal resistance is dif ficult to mea - sure and, consequently, is not specified. the resistive switching time variation versus gate resis - tance (figure 9) shows how typical switching performance is affected by the parasitic circuit elements. if the parasitics were not present, the slope of the curves would maintain a value of unity regardless of the switching speed. the circuit used to obtain the data is constructed to minimize common inductance in the drain and gate circuit loops and is believed readily achievable with board mounted components. most power electronic loads are inductive; the data in the figure is taken with a resistive load, which approximates an optimally snubbed inductive load. power mosfets may be safely op- erated i nt o a n i nductiv e l oad ; h owever , s nubbin g r educes switching losses. figure 7. capacitance variation gatetosource or draintosource voltage (volts) c, cap acitance (pf) 10 0 10 15 25 v gs v ds t j = 25 c v ds = 0 v v gs = 0 v 1400 1000 0 20 c iss c oss c rss 5 5 c iss c rss 1800 1200 200 1600 400 600 800
5 motorola tmos power mosfet transistor device data draintosource diode characteristics figure 8. gatetosource and draintosource voltage versus total charge figure 9. resistive switching time variation versus gate resistance figure 10. diode forward voltage versus current q g , total gate charge (nc) 12 8 4 0 0 2 4 6 8 90 v ds , draint osource vol tage (vol ts) v gs , ga tetosource vol tage (vol ts) 75 45 30 15 0 t j = 25 c i d = 10 a q t q 2 q 3 v gs t, time (ns) 1000 100 10 1 1 10 100 r g , gate resistance (ohms) t j = 25 c i d = 10 a v ds = 100 v v gs = 5 v t d(off) t d(on) t f t r v ds 10 60 q 1 v sd , sourcetodrain voltage (volts) i s , source current (amps) 0.5 0.9 1.0 0 10 0.8 0.6 0.7 6 2 4 8 v gs = 0 v t j = 25 c safe operating area the forward biased safe operating area curves define the m aximu m s imultaneou s d raintosourc e v oltage a nd drain current that a transistor can handle safely when it is for - ward biased. curves are based upon maximum peak junc - tion temperature and a case temperature (t c ) of 25 c. peak repetitive pulsed power limits are determined by using the thermal response data in conjunction with the procedures discussed in an569, at ransient thermal resistancegener- al data and its use.o switching between the of fstate and the onstate may tra - verse any load line provided neither rated peak current (i dm ) nor rated voltage (v dss ) is exceeded and the transition time (t r ,t f ) do not exceed 10 m s. in addition the total power aver - aged o ve r a c omplet e s witchin g c ycl e m us t n o t e xceed (t j(max) t c )/(r q jc ). a power mosfet designated efet can be safely used in switching circuits with unclamped inductive loads. for reli - able operation, the stored energy from circuit inductance dis - sipated in the transistor while in avalanche must be less than the rated limit and adjusted for operating conditions dif fering from those specified. although industry practice is to rate in terms of energy , avalanche energy capability is not a con - stant. the energy rating decreases nonlinearly with an in - crease o f p ea k c urrent i n a valanch e a n d p ea k j unction temperature. although many efets can withstand the stress of drain tosource avalanche at currents up to rated pulsed current (i dm ), the energy rating is specified at rated continuous cur- rent (i d ), in accordance with industry custom. the energy rat - ing m us t b e d erate d f o r t emperatur e a s s how n i n t he accompanying graph (figure 12). maximum energy at cur - rents below rated continuous i d can safely be assumed to equal the values indicated.
6 motorola tmos power mosfet transistor device data safe operating area figure 11. maximum rated forward biased safe operating area figure 12. maximum avalanche energy versus starting junction temperature t, time (ms) figure 13. thermal response r(t), normalized effective transient thermal resist ance r q jc (t) = r(t) r q jc d curves apply for power pulse train shown read time at t 1 t j(pk) t c = p (pk) r q jc (t) p (pk) t 1 t 2 duty cycle, d = t 1 /t 2 figure 14. diode reverse recovery waveform di/dt t rr t a t p i s 0.25 i s time i s t b 0.00001 0.0001 0.01 0.001 0.1 1.0 10 0.01 0.1 0.2 0.02 0.01 single pulse 0.1 0.05 1.0 d = 0.5 , single pulse draint osource as e t j , starting junction temperature ( c) avalanche energy (mj) i d = 10 a 30 20 10 0 25 50 75 100 125 150 100 10 1 0.1 0.1 1 10 100 100 m s 10 m s 1 ms 10 ms dc v ds , draintosource voltage (volts) i d , drain current (amps) r ds(on) limit thermal limit package limit v gs = 20 v single pulse t c = 25 c 40 50
7 motorola tmos power mosfet transistor device data information for using the dpak surface mount package recommended footprint for surface mounted applications surface mount board layout is a critical portion of the total design. the footprint for the semiconductor packages must be the correct size to ensure proper solder connection interface between the board and the package. with the correct pad geometry, the packages will self align when subjected to a solder reflow process. 0.190 4.826 mm inches 0.100 2.54 0.063 1.6 0.165 4.191 0.118 3.0 0.243 6.172 power dissipation for a surface mount device the power dissipation for a surface mount device is a function of the drain pad size. these can vary from the minimum pad size for soldering to a pad size given for maximum power dissipation. power dissipation for a surface mount device is determined by t j(max) , the maximum rated junction temperature of the die, r q ja , the thermal resistance from the device junction to ambient, and the operating temperature, t a . using the values provided on the data sheet, p d can be calculated as follows: p d = t j(max) t a r q ja the values for the equation are found in the maximum ratings table on the data sheet. substituting these values into the equation for an ambient temperature t a of 25 c, one can calculate the power dissipation of the device. for a dp ak device, p d is calculated as follows. p d = 150 c 25 c 71.4 c/w = 1.75 watts the 71.4 c/w for the dp ak package assumes the use of the recommended footprint on a glass epoxy printed circuit board to achieve a power dissipation of 1.75 w atts. there are other alternatives to achieving higher power dissipation from the surface mount packages. one is to increase the area of the drain pad. by increasing the area of the drain pad, the power dissipation can be increased. although one can almost double the power dissipation with this method, one will be giving up area on the printed circuit board which can defeat the purpose of using surface mount technology . for example, a graph of r q ja versus drain pad area is shown in figure 15. figure 15. thermal resistance versus drain pad area for the dpak package (typical) 1.75 watts board material = 0.0625 g10/fr4, 2 oz copper 80 100 60 40 20 10 8 6 4 2 0 3.0 watts 5.0 watts t a = 25 c a, area (square inches) to ambient ( c/w) r ja , thermal resist ance, junction q another alternative would be to use a ceramic substrate or an aluminum core board such as thermal clad ? . using a board material such as thermal clad, an aluminum core board, the power dissipation can be doubled using the same footprint.
8 motorola tmos power mosfet transistor device data solder stencil guidelines prior to placing surface mount components onto a printed circuit board, solder paste must be applied to the pads. solder stencils are used to screen the optimum amount. these stencils are typically 0.008 inches thick and may be made of brass or stainless steel. for packages such as the sc59, sc70/sot323, sod123, sot23, sot143, sot223, so8, so14, so16, and smb/smc diode packages, the stencil opening should be the same as the pad size or a 1:1 registration. this is not the case with the dp ak and d 2 pak packages. if one uses a 1:1 opening to screen solder onto the drain pad, misalignment and/or atombstoningo may occur due to an excess of solder. for these two packages, the opening in the stencil for the paste should be approximately 50% of the tab area. the opening for the leads is still a 1:1 registration. figure 16 shows a typical stencil for the dp ak and d 2 pak packages. the pattern of the opening in the stencil for the drain pad is not critical as long as it allows approximately 50% of the pad to be covered with paste. ??? ??? ??? ??? ??? ??? ??? ??? ??? ??? ??? ??? ??? ??? ??? ??? ??? ??? ?? ?? ?? ?? ?? ?? ?? ?? ?? ?? ?? ?? figure 16. typical stencil for dpak and d 2 pak packages solder paste openings stencil soldering precautions the melting temperature of solder is higher than the rated temperature of the device. when the entire device is heated to a high temperature, failure to complete soldering within a short time could result in device failure. therefore, the following items should always be observed in order to minimize the thermal stress to which the devices are subjected. ? always preheat the device. ? the delta temperature between the preheat and soldering should be 100 c or less.* ? when preheating and soldering, the temperature of the leads and the case must not exceed the maximum temperature ratings as shown on the data sheet. when using infrared heating with the reflow soldering method, the difference shall be a maximum of 10 c. ? the soldering temperature and time shall not exceed 260 c for more than 10 seconds. ? when shifting from preheating to soldering, the maximum temperature gradient shall be 5 c or less. ? after soldering has been completed, the device should be allowed to cool naturally for at least three minutes. gradual cooling should be used as the use of forced cooling will increase the temperature gradient and result in latent failure due to mechanical stress. ? mechanical stress or shock should not be applied during cooling. * soldering a device without preheating can cause excessive thermal shock and stress which can result in damage to the device. * due to shadowing and the inability to set the wave height to incorporate other surface mount components, the d 2 pak is not recommended for wave soldering.
9 motorola tmos power mosfet transistor device data typical solder heating profile for any given circuit board, there will be a group of control settings that will give the desired heat pattern. the operator must set temperatures for several heating zones, and a figure for belt speed. t aken together , these control settings make up a heating aprofileo for that particular circuit board. on machines controlled by a computer , the computer remembers these profiles from one operating session to the next. figure 17 shows a typical heating profile for use when soldering a surface mount device to a printed circuit board. this profile will vary among soldering systems but it is a good starting point. factors that can af fect the profile include the type of soldering system in use, density and types of components on the board, type of solder used, and the type of board or substrate material being used. this profile shows temperature versus time. the line on the graph shows the actual temperature that might be experienced on the surface of a test board at or near a central solder joint. the two profiles are based on a high density and a low density board. the v itronics smd310 convection/in - frared reflow soldering system was used to generate this profile. the type of solder used was 62/36/2 t in lead silver with a melting point between 177 189 c. when this type of furnace is used for solder reflow work, the circuit boards and solder joints tend to heat first. the components on the board are then heated by conduction. the circuit board, because it has a large surface area, absorbs the thermal energy more efficiently, then distributes this energy to the components. because of this ef fect, the main body of a component may be up to 30 degrees cooler than the adjacent solder joints. step 1 preheat zone 1 arampo step 2 vent asoako step 3 heating zones 2 & 5 arampo step 4 heating zones 3 & 6 asoako step 5 heating zones 4 & 7 aspikeo step 6 vent step 7 cooling 200 c 150 c 100 c 50 c time (3 to 7 minutes total) t max solder is liquid for 40 to 80 seconds (depending on mass of assembly) 205 to 219 c peak at solder joint desired curve for low mass assemblies 100 c 150 c 160 c 170 c 140 c figure 17. typical solder heating profile desired curve for high mass assemblies
10 motorola tmos power mosfet transistor device data package dimensions case 369a13 issue w style 2: pin 1. gate 2. drain 3. source 4. drain d a k b r v s f l g 2 pl m 0.13 (0.005) t e c u j h t seating plane z dim min max min max millimeters inches a 0.235 0.250 5.97 6.35 b 0.250 0.265 6.35 6.73 c 0.086 0.094 2.19 2.38 d 0.027 0.035 0.69 0.88 e 0.033 0.040 0.84 1.01 f 0.037 0.047 0.94 1.19 g 0.180 bsc 4.58 bsc h 0.034 0.040 0.87 1.01 j 0.018 0.023 0.46 0.58 k 0.102 0.114 2.60 2.89 l 0.090 bsc 2.29 bsc r 0.175 0.215 4.45 5.46 s 0.020 0.050 0.51 1.27 u 0.020 0.51 v 0.030 0.050 0.77 1.27 z 0.138 3.51 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. motorola reserves the right to make changes without further notice to any products herein. motorola makes no warranty , representation or guarantee regarding the suitability of its products for any particular purpose, nor does motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability , including without limitation consequential or incidental damages. at ypicalo parameters can and do vary in dif ferent applications. all operating parameters, including at ypicalso must be validated for each customer application by customer ' s technical experts. motorola does not convey any license under its patent rights nor the rights of others. motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body , or other applications intended to support or sustain life, or for any other application in which the failure of the motorola product could create a situation where personal injury or death may occur . should buyer purchase or use motorola products for any such unintended or unauthorized application, buyer shall indemnify and hold motorola and its of ficers, employees, subsidiaries, af filiates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly , any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that motorola was negligent regarding the design or manufacture of the part. motorola and are registered trademarks of motorola, inc. motorola, inc. is an equal opportunity/af firmative action employer . literature distribution centers: usa: motorola literature distribution; p .o. box 20912; phoenix, arizona 85036. europe: motorola ltd.; european literature centre; 88 t anners drive, blakelands, milton keynes, mk14 5bp , england. jap an: nippon motorola ltd.; 4321, nishigotanda, shinagawaku, t okyo 141, japan. asia p acific: motorola semiconductors h.k. ltd.; silicon harbour center , no. 2 dai king street, t ai po industrial estate, t ai po, n.t., hong kong. mtd10n10el/d
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